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Semiconductor Equipment
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Dicing Ancillary equipment
967 Automatic Wafer Laminator
It is designed for automatic mounting of workpieces to the dicing frame.967 Laminator boasts fast, bubble-free, accurate and cost-effective tape bonding
966 Wafer Laminator
It is designed for manual mounting of workpieces onto adhesive tape.Support various types of dicing tapes and standard frames. Customizable for a wide range of substrates (multiple panels) and irregular frames
977 Wafer Washer
It is designed for post-cut workpiece cleaning and drying, equipped with a rotary table chuck and rotary washing/drying arm. Atomizing nozzles or high-pressure nozzles are available to meet various cleanliness requirements.
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