Dicing Ancillary equipment
967 Automatic Wafer Laminator
It is designed for automatic mounting of workpieces to the dicing frame.967 Laminator boasts fast, bubble-free, accurate and cost-effective tape bonding
966 Wafer Laminator
It is designed for manual mounting of workpieces onto adhesive tape.Support various types of dicing tapes and standard frames. Customizable for a wide range of substrates (multiple panels) and irregular frames
977 Wafer Washer
It is designed for post-cut workpiece cleaning and drying, equipped with a rotary table chuck and rotary washing/drying arm. Atomizing nozzles or high-pressure nozzles are available to meet various cleanliness requirements.
955 UV Degumming System
It is designed for UV tape curing after the cutting process by reducing the adhesive strength to make the removal easy.