62306230 is a high precision, high efficiency dual-spindle wafer dicing machine. Its maximum machining size is 12'', with the smallest footprint of its kind.

ADT 8020 Dicing System has two face-to-face spindles to cut wafers simultaneously with higher productivity. This high precision system cuts wafers sized up to 8'' in diameter with high performance and low running costs.

7200 series system is equipped with a variety of advanced automation and process monitoring capabilities to meet the yielding capacity throughput and quality requirements of the most demanding cuts: Silicon, silica glass, glass, BGA and QFN packages, LTCC, ceramic, PCB and other hard materials.

ADT 7900 series has two face-to-face spindles that conduct simultaneous wafer dicing or packaging to increase productivity. This high precision system boasts outstanding dicing performance and low running costs.

ADT 7900 series has two face-to-face spindles that conduct simultaneous wafer dicing or packaging to increase productivity. This high precision system boasts outstanding dicing performance and low running costs.

The tilting spindle dicing system provides both perpendicular cuts and 8° angular cuts, which suppresses back-reflection from fiber optic components and meets the needs of optoelectronic component manufacturers.

Model 7120/7130 2'' and 4'' spindle dicing systems are highly cost-effective and of high flexibility to meet your needs.

ADT 8230ADT 8230 is a high efficiency, high precision, high performance and durable dual-spindle (face-to-face) full-automatic wafer dicing machine. It can cut workpieces sized up to 12''.