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8020 Full-automatic Dual-Spindle Wafer Dicing Machine
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Product Introduction
ADT 8020 Dicing System has two face-to-face spindles to cut wafers simultaneously with higher productivity. This high precision system cuts wafers sized up to 8'' in diameter with high performance and low running costs.
Features & Advantages
◎Flexibility: Support hub and hubless dicing blades sized up to 3'' in outer diameter
◎1.8kw or 2.4kW high power spindle (suitable for high-standard applications)
◎Large 19'' touch screen with a concise interface
◎It uses a locking spindle supporting quick and easy blade change
◎SECS/GEM ready
Keyword:
Full-automatic Dual-Spindle Wafer Dicing Machine
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