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7920/30 Duo Automatic Dual-Spindle Dicing Machine
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详情描述
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性能特征
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Product Introduction
ADT 7900 series has two face-to-face spindles that conduct simultaneous wafer dicing or packaging to increase productivity. This high precision system boasts outstanding dicing performance and low running costs.
Features & Advantages
◎Quick and easy tool change | SECS/GEM ready
◎Reachability to any area of the system for easy maintenance
Keyword:
Duo Automatic Dual-Spindle Dicing Machine
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