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8230 Full-automatic Dual-Spindle Wafer Dicing Equipment
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Product Introduction
ADT 8230ADT 8230 is a high efficiency, high precision, high performance and durable dual-spindle (face-to-face) full-automatic wafer dicing machine. It can cut workpieces sized up to 12''.
Features & Advantages
◎Flexibility - Blades up to 3''
◎1.8KW or 2.2KW high power spindle (suitable for higher-standard dicing)17'' touch screen with a concise interface
Keyword:
Full-automatic Dual-Spindle Wafer Dicing Equipment
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