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Semiconductor Equipment
AC-70 Washe
Product Introduction
AC-70 Washer cleans the workpiece after cut by the dicing machine. Washing procedures can be set according to the size and cleanliness requirements to be effective and efficient. AC-70 Washer uses a water-gas two-fluid nozzle for wafer washing. The water drop is atomized under the pressure of compressed air and sprayed onto the surface of the workpiece at high speed. It washes the workpiece without damaging it.
Features & Advantages
◎Washing: water-gas two-fluid nozzle, single-arm
◎Drying: clean agent gas
◎Human-computer interaction: 7'' touch screen
◎Feeding/blanking: manually
◎Driving mode of rotary table: servo motor
◎Washing/drying time setting: flexible
◎Position control of worktable: The worktable shall stop at the same angle position after each washing task
◎Driving mode of the swing arm of nozzle: stepping motor
◎Rotational speed of the swing arm of nozzle: Core ≤ 37.50/s
◎Short circuit protection and overload protection capability
◎Vacuum pressure and intake pressure detection: digital pressure sensor