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AW-100 Semi-automatic Expander

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Product Introduction

It runs as a complex motion system composed of expanding module, retaining ring module, dicing module, software system and operating system. It is to expand the spacing between chips after the wafer dicing process.

Features & Advantages

◎It uses a Kinco touch screen that supports settings of equipment parameters.

◎Support both automatic and manual operation

◎Real-time height display

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