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Semiconductor Equipment
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AW-100 Semi-automatic Expander
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详情描述
Parameters
性能特征
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Product Introduction
It runs as a complex motion system composed of expanding module, retaining ring module, dicing module, software system and operating system. It is to expand the spacing between chips after the wafer dicing process.
Features & Advantages
◎It uses a Kinco touch screen that supports settings of equipment parameters.
◎Support both automatic and manual operation
◎Real-time height display
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