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6230 Semi-Automatic Dual-Spindle Dicing Equipment
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详情描述
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Product Introduction
62306230 is a high precision, high efficiency dual-spindle wafer dicing machine. Its maximum machining size is 12'', with the smallest footprint of its kind.
Features & Advantages
◎Superb dicing quality
Transparent design
Low vibration spindle
Minimized affecting factors of dicing quality promised by an optimized structure
◎Easy operation
17'' touch screen to show the machine running status simultaneously during the cutting process
Tracking keyboard design for more efficient data editing
Multi-touch design for higher efficient operation
One-click return to the Home Screen
◎Smaller footprint
It has the smallest footprint of any machine of its kind.
Keyword:
Semi-Automatic Dual-Spindle Dicing Equipment
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