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72xx Full-automatic Dicing System
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详情描述
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Product Introduction
7200 series system is equipped with a variety of advanced automation and process monitoring capabilities to meet the yielding capacity throughput and quality requirements of the most demanding cuts: Silicon, silica glass, glass, BGA and QFN packages, LTCC, ceramic, PCB and other hard materials.
Features & Advantages
◎Efficient wafer processing system
◎Visual system supporting continuous digital zooming
◎Blade wear prediction algorithm is adopted to promote shortened height measuring time and higher hourly output
◎Subtle vapor cleaning of wafer
Keyword:
Full-automatic Dicing System
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