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7900 8″Duo Automatic Dual-Spindle Dicing Machine
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Product Introduction
ADT 7900 series has two face-to-face spindles that conduct simultaneous wafer dicing or packaging to increase productivity. This high precision system boasts outstanding dicing performance and low running costs.
Features & Advantages
◎Flexibility: Support hub and hubless dicing blades sized up to 3'' (OD)
◎Large 17'' touch screen with a concise interface
◎2.4 kW high power spindle (suitable for demanding applications)
◎Small footprint
◎Advanced visual system to support continuous zooming
Keyword:
Duo Automatic Dual-Spindle Dicing Machine
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