Introduction

SEMI recently announced that the shipment amount of semiconductor device manufacturers in North America reached US$3.04 billion in January, hitting the US$3 billion mark for the first time, which undoubtedly made a good start for the year. The semiconductor industry, surviving from the coronavirus-induced impact, is poised to usher in a new boom!

SEMICON China 2021 kicks off at the Shanghai New International Expo Center as scheduled. After the pandemic shock last year, SEMICON China this year shows more energy. With the theme of "Connect, Collaborate, Innovate", this exhibition focuses on the global semiconductor industry landscape, market trends and cutting-edge technologies, building a global platform for semiconductor equipment suppliers. GLTech's semiconductor packaging and testing equipment (ADT, Loadpoint), which represents its core technologies and products, is unveiled in this exhibition.

ADT 8230 - 12" full-automatic dual-spindle dicing saw

An excellent dicing saw

The ADT 8230 12" full-auto dual-spindle dicing saw uses a height-adjustable air spindle produced by LPB, a Britain-based wholly-owned subsidiary of GLTech. While showing a high rotational speed, it features ultra-low vibration to greatly reduce the internal stress damage to wafers as well as prevent wafer chipping during the dicing process. Its dual-spindle design supports multiple dicing modes, greatly improving the work efficiency. ADT 8230 is equipped with a standard blade breakage detection unit and a non-contact height measuring system, and it uses the upgraded BBD algorithm to ensure automatic tool mark detection and higher precision straightening during the dicing process, allowing for its preparation of higher density, higher performance integrated circuit chips and improved chip yield.

A brand-new dicing saw

- 6110 6" semi-automatic single-spindle dicing saw

The 6" single-spindle semi-automatic dicing machine jointly developed by ADT and Guangli Ruihong is on display during this exhibition. It covers a small area and is configured with a British Loadpoint Bearings 2.2kW high-speed rotating spindle (torque: 0.34Nm, maximum rotational speed: 60,000RPM) and a 17" LCD touch screen with a user-friendly operation interface. With the θ-axis driven by a DD motor, this machine features high rotational accuracy and high rotational resolution, and can recognize fragment shapes and precisely cut silicon wafers, PCB boards, and ceramics. It is a highly useful device.

Core component—Loadpoint high-precision air spindle

During this exhibition, the high-precision air spindle provided by Loadpoint, a wholly-owned subsidiary of GLTech, has the advantages of ultra-high precision, ultra-high rotational speed and ultra-high rigidity. Focusing on the R&D and manufacturing of core components of semiconductors, the company will strive to become a leader in the global semiconductor industry chain and semiconductor localization process. As mentioned in the SEMI Summit, core components are likely to be the next key area for investment.

High precision, high rotational speed, high rigidity

Nano-scale positioning accuracy, rotational speed up to 60,000RPM

GLTech's new strategic positioning—a semiconductor manufacturer with focus on high-performance and high-precision air spindles

GLTech will make full use of its unique sensor development and application capability and high-speed motor driving technology to develop more other products in addition to air spindles while strengthening its original business. SEMI Global Vice President Ju Long said: "The semiconductor industry calls for global cooperation." In the face of new challenges and new opportunities, GLTech will continue to leverage its advantages to integrate resources and realize the intelligent manufacturing and integration of chips, displays, and devices. Its wholly-owned subsidiaries Loadpoint and Loadpoint Bearings will be merged into one, collectively referred to as Loadpoint, to specialize in the R&D and manufacturing of core components dominated by high-speed and high-precision air spindles. It will introduce Zhang Peng (former chairman and general manager of Oxford Instruments China) to the ADT management team, expecting that he can lead the company's semiconductor packaging and testing team to step out of the comfort zone and climb to a new height.

GLTech will continue forging ahead with innovation and pursue the intelligent manufacturing and integration of chips, displays, and devices.