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8230Full-automatic Dual-Spindle Wafer Dicing Equipment
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- Time of issue:2021-12-07
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(Summary description)ADT 8230ADT 8230 is a high efficiency, high precision, high performance and durable dual-spindle (face-to-face) full-automatic wafer dicing machine. It can cut workpieces sized up to 12''.
8230Full-automatic Dual-Spindle Wafer Dicing Equipment
(Summary description)ADT 8230ADT 8230 is a high efficiency, high precision, high performance and durable dual-spindle (face-to-face) full-automatic wafer dicing machine. It can cut workpieces sized up to 12''.
- Categories:Solution
- Author:
- Origin:
- Time of issue:2021-12-07 19:58
- Views:
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ADT 8230ADT 8230 is a high efficiency, high precision, high performance and durable dual-spindle (face-to-face) full-automatic wafer dicing machine. It can cut workpieces sized up to 12''.
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